Job Opportunity at Ulkasemi

Publish Date : 20th September, 2020

Job Circular

 

Post Name: Trainee Engineer, IC Physical Design
Required Number of Position: 05

Job Overview:

Physical Design Engineer implements the entire SoC design flow from RTL to GDS to create a design database ready for manufacturing with special focus on power, performance & area optimization utilizing the next generation state of the art process technology.

Job Description:

  • Perform physical design implementation which includes Floorplanning, Power Planning, Clock Tree Synthesis, Place and Route, ECO, Equivalency checks
  • Timing, physical & electrical verification, driving the signoff closure meeting schedule and design goals
  • Prepare deliverables & perform QA
  • Communicate with the logic designers to develop timing, power and area design targets, and explore design tradeoffs for physical design closure.
  • Develop flow and methodologies for physical design and automation scripts for various implementation steps.

 Educational Qualification:  B.Sc/ M.Sc in EEE from any reputed university

Additional Job Requirements:

  • Willing to build career in VLSI industry
  • Applicants are expected to complete courses which encompass the following topics–

○       Digital Devices and Electronics

○       VLSI Design with VHDL and/or Verilog

  • Knowledge in IC Physical Design (PnR) will be treated as an extra qualification
  • Familiarity with C/C++ or any programming language
  • Knowledge of Linux environment and scripting languages like Perl, Python, TCL/Tk, shell scripting would be an advantage
  • Able to handle multitasking and work under pressure
  • Able to work with teams from different locations and time zones
  • Good analytical and debugging capabilities is must
  • Good communication skills, both oral and written
  • Demonstrate good team player attitude
  • High degree of initiative, enthusiasm and thinking out-of-the-box attitude

 

How to Apply

Please submit your CV to jobs@ulkasemi.com. Write the post name in the subject of mail.

Application Deadline: October 5, 2020

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