Publish Date : 23rd September, 2021


Post Name: Trainee Engineer, IC Physical Design (PnR)
Number of Open Positions: 10

Job Overview:
Physical Design Engineer implements the entire ASIC/SoC back end design flow from RTL to
GDSII to create design databases ready for manufacturing with special focus on
power, performance & area optimization with next generation state of the art process

Job Description:
● Perform physical design implementation which includes Floor planning, Power
Planning, Clock Tree Synthesis, Place and Route, ECO, Equivalency checks
● Timing, physical & electrical verification, driving the signoff closure meeting schedule
and design goals
● Prepare deliverables & perform QA
● Communicate with the front end team to develop timing, power and area
design targets, and explore design trade-offs for physical design closure
● Develop flow and methodologies for physical design and automation scripts for various
implementation steps
Educational Qualification: B.Sc/M.Sc in EEE or equivalent disciplines with an emphasis
on VLSI design from any reputed university
Additional Job Requirements:
● Willing to build a career in the VLSI industry
● Applicants are expected to complete courses which encompass the following topics–
○ Digital Devices and Electronics
○ VLSI Design with VHDL and/or Verilog
● Knowledge in IC Physical Design (PnR) or the back end ASIC/SoC design flow will bear
significant weight
● Familiarity with C/C++ or any programming language
● Working knowledge of the Linux environment and scripting languages like Perl,
Python, TCL/Tk, shell scripting would be an advantage
● Should be able to multitask and work under pressure
● Should be able to work with teams from different locations and time zones
● Good analytical and debugging capabilities is must
● Good communication skills, both oral and written
● Must be able to work well as part of a team
● High degree of initiative, enthusiasm and out-of-the-box thinking


How to Apply
Please submit your CV to jobs@ulkasemi.com. Write the post name in the subject of mail.
Application Deadline: Sept 30, 2021

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